Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2019 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. In addition to paper presentations and vendor exhibits, ITherm 2019 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional development courses. Other activities include the Student Poster and Networking Session and Art-in-Science Exhibition.

Our abstract submission website is now open, and we encourage your submissions through September 3, 2018. Review the details in our Call for Abstracts.