Call for Abstracts 

ITherm 2016: Fifteenth Intersociety Conference on

Thermal and Thermomechanical Phenomena in Electronic Systems

May 31 – June 3, 2016

Cosmopolitan Hotel of Las Vegas, Las Vegas, Nevada, USA (www.cosmopolitanlasvegas.com)

ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo- mechanical and emerging technology issues associated with electronic devices, packages, and systems. ITherm 2016 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2016, http://www.ectc.net), a premier electronic packaging conference, at the Cosmopolitan Hotel in Las Vegas, Nevada, USA. Based on the success of ITherm 2014 in Orlando, Florida, USA, papers will be presented in oral and selected topical poster sessions. All papers will be peer reviewed by two or more reviewers, and will be published in the ITherm proceedings. In addition to paper presentations and vendor exhibits, ITherm 2016 will include panel discussions, keynote lectures by prominent speakers, and professional short courses. Original papers are solicited in the following general areas (but not limited to):

Thermal Management:

• Novel Materials: Thermal Vias, Heat Spreaders and Thermal Interface Materials
• Natural and Forced Convection Air Cooling
• Advances in Compact Air Movers
• Single-Phase Liquid Cooling
• Novel Phase Change Cooling Techniques: Boiling, Thin Film Evaporation, Heat Pipes, Thermosyphon, Spray and Jet Impingement
• Microfabricated Thermal Management Devices and Systems
• Sub-Ambient Cooling: Solid State, Vapor Compression, Absorption, Adsorption, Thermo-acoustic, Magnetocaloric
• Thermal Management in Wireless, Networking, Computing, Lighting, Harsh Environments, and Peripheral Hardware.
• Thermal and Energy Management in Data Centers
• Three-Dimensional Electronics
• Advances in Experimental Characterization
• Advances in Computational Characterization: Multi-Scale Modeling, Compact Modeling, Multi-Physics Modeling, Multi-Objective Design and Optimization

Mechanics:

• Modeling and Simulation for Reliability at Package, Board, and System Levels
• Failure Mechanics and Damage Modeling
• Experimental Techniques
• Constitutive Models
• Impact, Drop and Vibrational Analysis of Packages, Sub-Systems, and Systems
• Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects
• Materials Characterization, Simulation, Design

Emerging Technologies:

• Sensors (Medical, Military, Consumer, Structures, Diagnostic, etc.)
• Nanotechnology: Thermal, Mechanics, Material and Process Related Issues in Nanostructures
• Micro-Fluidics
• Chip-Integrated/Embedded Cooling Systems
• Fiber-Optics Interconnect Systems & Free Space Optical Interconnects
• MEMS: Device and Package Level Reliability Issues
• Integrated Biochips and Bioelectronics
• Medical, Telecommunication, and Automotive Systems
• Space Systems: Earth Orbiting and Deep-Space Missions

Please submit a 400 word text-only (no figures and tables) abstract on the ITherm website: http://www.ieee-itherm.org. More information: http://www.ieee-itherm.org/author-center Abstract and subsequent paper submissions are entirely web-based, with the following deadlines:

Some important dates:

• Deadline for Abstracts: September 4, 2015
• Notification of Acceptance: October 2, 2015
• Draft Paper Submission: December 4, 2015
• Final Paper Submission: March 4, 2016

Direct general inquiries to:

Dr. Madhu Iyengar, General Chair Google, miyengar@gmail.com

Professor Michael Ohadi, Program Chair University of Maryland, ohadi@umd.edu

Visit the ITHERM Website: http://www.ieee-itherm.org 

This is the first time that the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) and the International Conference on Nanochannels, Microchannels and Minichannels (ICNMM) will jointly hold their conferences together.
InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging, MEMS, and NEMS. It is the flagship conference of the Electronics and Photonics Packaging Division (EPPD). The InterPACK conference series was founded in 1992 as the ASME-JSME Joint Electronics Packaging Conference. It was renamed InterPACK in 1995 and has occurred biannually since then. The conference is held in technical co-operation with the Japanese Society of Mechanical Engineering (JSME). InterPACK attracts researchers and practitioners from academia, industry, and government and serves as a venue for knowledge dissemination and collaboration amongst its participants.
InterPACK supports EPPD’s mission to (a) promote the art, science, and practice of electrical, electronic, and photonics packaging; (b) encourage and foster research, development, and dissemination of reliable data and results of engineering importance pertaining to subjects within the division’s scope of activities; (c) encourage the interchange of ideas among engineers by encouraging the preparation and publication of papers in the field of electrical, electronic, and photonics packaging; and (d) encourage the organization of programs for the presentation and discussion of papers where all members of the Society may meet on an equal basis to exchange experiences and technical data. InterPACK also strives to encourage new membership by fostering graduate student participation and encouraging them to join ASME and EPPD. As part of the peer-review process, and further review by the conference leadership, the highest quality papers in the conference are recommended for publication in the Journal of Electronic Packaging (JEP).
InterPACK also supports ASME’s mission to serve diverse global communities by co-sponsoring the event with JSME. In addition to Japan, the conference attracts other participants from eastern Asia: South Korea, China, Taiwan, and Singapore to name a few. We also have participation from Europe and from the Middle East.
ICNMM provides a global platform for researchers to exchange information and identify research needs in the emerging areas of microscale and nanoscale transport processes and systems encompassing many engineering and bio-medical disciplines. In particular, participation from the young researchers is emphasized. The field of microscale transport processes and microfluidics is becoming extremely important in a number of emerging technologies. It has already found a number of practical application in biological sciences (DNA detection), microprocessor chip cooling, pharmaceutical sciences (micromixers and micro-reactors), optics (switching devices), fuel cells (gas diffusion channels and gas diffusion layer), micro-power generation, microturbines, etc. The conference provides a unique forum for interdisciplinary researchers to exchange ideas and come up with novel techniques. This will be the thirteenth planned international conference on this topic.
ICNMM’s main objective is to provide a multi-disciplinary forum to promote and expedite progress on fundamental understanding and applications in many different fields. The international nature of the meeting is highly beneficial to everyone for global interaction. The conference series has become a huge success among researchers in diverse fields with participation from international delegates. The conference is viewed as a premiere conference in this area and enjoys a relatively small size that allows individual interactions among researchers.
Conference Topics

• Advanced Electronics and Photonics: Packaging, Interconnect and Reliability
• Emerging Technology Frontiers
• MEMS and NEMS
• Thermal Management
• Thermal Management Using Micro Channels, Jets, Sprays
• Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
• Advanced Fabrication and Manufacturing
• Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices
• Panels
• Technology Update Talks
• Mini Workshops and Tutorials
• Student Poster and Networking Session
• Exhibits, Vendors, and Sponsors (Technical Presentation)
• Advanced Electronics and Photonics, Packaging Materials and Processing